Selective planarization method using regelation

Details Selective planarization method using regelation Selective planarization method using regelation

1993-09-10

1994-09-20

Thomas, Tom

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156636, 156645, 437228, 437225, H01L 21306

Patent

active

053486153

ABSTRACT:
Technique and apparatus for planarizing microsteps on a substrate by compressing the surface to be smoothed against a frozen layer of an etchant, where the compressive force is sufficient to melt the etchant at the contact edges between said microsteps and said etchant.

REFERENCES:
patent: 5009240 (1991-04-01), Levi
patent: 5264074 (1993-11-01), Muroyama et al.

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