Selective metallization process and additive method for manufact

Details Selective metallization process and additive method for manufact Selective metallization process and additive method for manufact

1986-11-10

1988-05-31

Kittle, John E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430319, 430329, 427 98, G03C 500

Patent

active

047481048

ABSTRACT:
A process for selective metallization of a substrate in a predetermined desired pattern, and particularly for the manufacture of printed circuit boards, in which a substrate patterned in desired manner with resist material is treated with conditioning agent, adjuvant and deactivating agent preparatory to catalytic activation and electroless deposit of metal flash. By proceeding in this manner, adherent flash metal deposit is achieved on non-resist areas without encountering significant plating on resist areas. Following metal flash deposit, the resist can be easily and cleanly stripped and additional metal then built up on the flash metal.

REFERENCES:
patent: 4668532 (1987-05-01), Moisan et al.

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