Selective etching of refractory metal nitrides

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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437200, 437192, B44C 122, H01L 2102

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active

054198054

ABSTRACT:
A method of selectively etching a layer of a refractory metal nitride, with application to formation of TiN local interconnects for VLSI integrated circuits, and particularly a method of selectively etching TiN relative to a refractory metal silicide. The method comprises the step of heating surfaces of the substrate to a selected etch temperature between 50.degree. C. and 200.degree. C. in a non-reactive gas and then exposing the heated substrate to reactive halogen species of a plasma having ion energies substantially less than 100 eV, and preferably below 30 eV. The etch selectivity is controlled by selecting a relatively low ion energy to reduce ion bombardment and heating effects during etching, and independently controlling the etch temperature in the heating step. The reactive species of the plasma are preferably generated by electron cyclotron resonance (ECR) excitation of a halocarbon containing gas, and heating comprises ion bombardment with a non-reactive gas. For etching TiN, preferred halocarbon containing gases are CF4 and C2F6, and mixtures thereof, whereby optimum etch selectivity is obtained with reactive species having ion energies less than 30 eV, and at an etch temperature in the range 100.degree. to 120.degree. C.

REFERENCES:
patent: 5010032 (1991-04-01), Tang et al.
patent: 5320971 (1994-06-01), Eklund et al.

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