Selective etching method of polyimide type resin film

Details Selective etching method of polyimide type resin film Selective etching method of polyimide type resin film

1982-11-30

1984-03-13

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156668, 156904, 252 791, 430313, 430317, B44C 122, C03C 1500, C03C 2506, B29C 1708

Patent

active

044365837

ABSTRACT:
Disclosed is a selective etching method of a polyimide type resin film which uses an etching mask consisting of a negative type photoresist material prepared by adding a photosensitive reagent to an unsaturated ketone polymer such as polymethylisopropenylketone as the base resin and an etching solution consisting of 20 to 40% by volume of hydrazine hydrate and the balance of a polyamine. The etching method of the present invention can provide the pattern of the polyimide type resin film having high dimensional accuracy by wet etching.

REFERENCES:
patent: 3833436 (1974-09-01), Hillis et al.

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