Selective deposition process for physical vapor deposition

Details Selective deposition process for physical vapor deposition Selective deposition process for physical vapor deposition

1989-06-08

1991-11-12

Simmons, David A.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 431, 427 531, 427 541, 427 561, 427124, B05D 306

Patent

active

050646818

ABSTRACT:
The invention relates to a dry method for depositing a material on a substrate having nucleating sites for the material which includes deposition of a material in the vapor phase on the substrate and simultaneous ablation of the substrate by ablation methods for controlled removal of the nucleating sites from the substrate. The removal of the nucleating sites is controlled to minimize or selectively prevent coating of the substrate by the material. The method can be used to form material patterns on the substrate such as electrical circuits or for adhering material to a substrate that is difficult to metallize such as organic polymers or ceramics.

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