Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1982-01-11
1983-10-25
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156628, 156630, 156634, 156643, 156656, 156664, 219121EK, 219121LJ, 252 792, C23F 100, B23K 900, C09K 1304
Patent
active
044117302
ABSTRACT:
Disclosed is a process for machining nickel-base superalloys wherein a thermal-effect process, such as laser or electric discharge machining, is first used to remove material but leaves a recast layer. Next a chemical milling process is used wherein the etchant only attacks and removes the recast layer. The etchant is comprised by volume percent of 40-60 HNO.sub.3, 5-20 HCl, and balance H.sub.2 O, with which is included 0.008-0.025 moles/liter FeCl.sub.3 and at least 0.016 moles/liter CuSO.sub.4. The FeCl.sub.3 improves removal rate but tends to cause unwanted pitting and intergranular attack. These tendencies are inhibited by the addition of CuSO.sub.4 ; preferably the molar ratio of CuSO.sub.4 to FeCl.sub.3 is 2:1. The beneficial combination of FeCl.sub.3 and CuSO.sub.4 is usable in other etchants.
REFERENCES:
patent: 3866398 (1975-02-01), Vernon et al.
patent: 4239954 (1980-12-01), Howard et al.
patent: 4353780 (1982-10-01), Fishter et al.
Fishter Robert E.
Lada Henry
Bokan Thomas
Nessler C. G.
Powell William A.
United Technologies Corporation
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