Selective and precise etching and plating of conductive substrat

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430311, 430313, 430319, 2041802, 2041086, 2041811, G03C 500

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active

052022226

ABSTRACT:
Method for selective and precise etching and plating of a conductive substrate through electrophoretic deposition of a photoresist composition. The invention enables chemical milling and plating of products useful in high performance applications such as lead frames with lead widths less than 1.0 mil and precisely plated lead faces.

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