Segmented sputtering target and method/apparatus for using same

Details Segmented sputtering target and method/apparatus for using same Segmented sputtering target and method/apparatus for using same

2005-04-12

2005-04-12

Versteeg, Steven (Department: 1753)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S192120, C204S192150, C204S298130, C204S298280

Reexamination Certificate

active

06878242

ABSTRACT:
A rotating sputtering target(s) is segmented so as to include a plurality of different sputtering material portions or segments radially dispersed around the outer periphery of the target. This enables a plurality of different layers to be sputter-deposited, one after the other, using the same sputtering target as the target rotates. The thicknesses of the different layers can be controlled by the radially extensive size of the different segments, the rotation speed of the target, the material sputter rate, the sputtering power used, and/or the line speed of the sputter coater in which the target(s) is located. One or more such targets may be used in a coater according to different embodiments of this invention.

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