Sectional molding system

Details Sectional molding system Sectional molding system

2006-04-18

2006-04-18

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S678000

Reexamination Certificate

active

07030504

ABSTRACT:
The invention provides a molding system for encapsulating a piece of substrate having a plurality of molding sections. The system comprises a molding device operative to separately encapsulate each molding section with a molding compound and indexing means operative to position said molding sections of the substrate relative to the molding device for encapsulation.

REFERENCES:
patent: 6114189 (2000-09-01), Chia et al.
patent: 6508970 (2003-01-01), Chandra
patent: 2004/0077130 (2004-04-01), Ho et al.
patent: 10-202669 (1998-04-01), None

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