Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2007-10-15
2009-10-20
Dang, Trung (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257SE23010, C438S107000
Reexamination Certificate
active
07605466
ABSTRACT:
Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants.
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Aimi Marco Francesco
Boomhower Oliver Charles
Claydon Glenn Scott
Gowda Arun Virupaksha
Hays David Cecil
Dang Trung
Emery Richard
General Electric Company
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