Sealant for electronics of epoxy resin, aromatic amine,...

Details Sealant for electronics of epoxy resin, aromatic amine,... Sealant for electronics of epoxy resin, aromatic amine,...

2011-07-19

2011-07-19

Sellers, Robert (Department: 1765)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C257S791000, C257S793000, C523S445000, C523S455000, C523S456000, C523S457000, C523S458000, C523S459000, C523S466000, C523S467000

Reexamination Certificate

active

07981977

ABSTRACT:
The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.

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S. Zhengguang, et al., “Preparation and Application of Organosilicone Surfactants”,New Chemical Materials, 2001, 29(3), pp. 10 and 11.

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