Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate
2009-05-13
2011-10-18
Lebentritt, Michael S (Department: 2829)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
Having specified scribe region structure
C438S461000, C438S460000, C438S463000, C438S464000, C438S465000, C257S048000, C257S797000, C257S798000
Reexamination Certificate
active
08039367
ABSTRACT:
A scribe line structure is disclosed. The scribe line structure includes a semiconductor substrate having a die region, a die seal ring region, disposed outside the die region, a scribe line region disposed outside the die seal ring region and a dicing path formed on the scribe line region. Preferably, the center line of the dicing path is shifted away from the center line of the scribe line region along a first direction.
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Hsu Winston
Kusumakar Karen M
Lebentritt Michael S
Margo Scott
United Microelectronics Corp.
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