Screen print under-bump metalization (UBM) to produce low...

Details Screen print under-bump metalization (UBM) to produce low... Screen print under-bump metalization (UBM) to produce low...

2006-01-31

2006-01-31

Zarabian, Amir (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C257S737000, C257S738000, C257S781000, C257S786000

Reexamination Certificate

active

06992001

ABSTRACT:
A method for forming an integrated circuit interconnect pad is described. In one embodiment a method of forming an integrated circuit comprises screen printing a conductive paste onto a terminal metalization pad and curing the conductive paste in an inert or reducing atmosphere at an elevated temperature to form an under-bump metalization layer of an interconnect pad. The elevated temperature is below a melting temperature of the terminal metalization pad.

REFERENCES:
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5133989 (1992-07-01), Numata et al.
patent: 5242511 (1993-09-01), Yokoyama et al.
patent: 5492611 (1996-02-01), Sugama et al.
patent: 6028357 (2000-02-01), Moriyama
patent: 6187615 (2001-02-01), Kim et al.
patent: 6214636 (2001-04-01), Sawayama et al.
patent: 6254923 (2001-07-01), Boyd et al.
patent: 6573161 (2003-06-01), Miyasaka et al.
patent: 2001/0002068 (2001-05-01), Farnworth et al.
patent: 2004/0066633 (2004-04-01), Yazaki et al.
patent: 2004/0082101 (2004-04-01), Honda
patent: 2004/0221449 (2004-11-01), Sugawa et al.

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