Schottky tunneling device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257330, 257331, 257472, 257 77, 257902, 257155, 257289, 257284, 257403, 257263, 257264, 257266, 257267, 257269, H01L 2978, H01L 2947

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059628936

ABSTRACT:
An n-semiconductor layer is arranged on a low-resistance n-substrate. A drain electrode is in ohmic contact with the n-substrate. A source electrode forms a Schottky junction with the n-semiconductor layer. A gate electrode is arranged adjacent to the source electrode on the n-semiconductor layer through a gate insulating film. When a voltage is applied to the gate electrode to lower the Schottky barrier height at the interface between the source electrode and the n-semiconductor layer, electrons are injected from the source electrode into the n-semiconductor layer, and a current flows in the semiconductor device. A diffusion layer which prevents a decrease in manufacturing time is not required to form in the n-semiconductor layer, and a channel which causes an increase in ON state voltage is not present.

REFERENCES:
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patent: 5049953 (1991-09-01), Mihara et al.
patent: 5396085 (1995-03-01), Baliga
patent: 5545905 (1996-08-01), Muraoka et al.
S. M. Sze, Physics of Semiconductor Devices, 2nd ed., 1981, pp. 245-304.
C. J. Koeneke, et al., "Shottky Mosfet for VLSI", IEDM 1981, (pp. 367-370).
T. Mochizuki, et al., "An n-Channel MOSFET With Shottky Source and Drain", IEEE Electron Device Letters, vol. EDL-5, No. 4, Apr. 1984, (pp. 108-111).
T. Yachi, et al., "A New Method Utilizing Ti-Silicide Oxidation for the Fabrication of a MOSFET with a Self-Aligned Schottky Source/Drain", IEEE Electron Device Letters, vol. EDL-5, No. 8, Aug. 1983, (pp. 277-279).

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