Schottky device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S348000, C257S403000

Reexamination Certificate

active

07071518

ABSTRACT:
A regular Schottky diode or a device that has a Schottky diode characteristic and an MOS transistor are coupled in series to provide a significant improvement in leakage current and breakdown voltage with only a small degradation in forward current. In the reverse bias case, there is a small reverse bias current but the voltage across the Schottky diode remains small due the MOS transistor. Nearly all of the reverse bias voltage is across the MOS transistor until the MOS transistor breaks down. This transistor breakdown, however, is not initially destructive because the Schottky diode limits the current. As the reverse bias voltage continues to increase the Schottky diodes begins to absorb more of the voltage. This increases the leakage current but the breakdown voltage is a somewhat additive between the transistor and the Schottky diode.

REFERENCES:
patent: 4227098 (1980-10-01), Brown et al.
patent: 4253162 (1981-02-01), Hollingsworth
patent: 6476442 (2002-11-01), Williams et al.
patent: 1233456 (1993-05-01), None
S. Kunori, et al., “120V Multi RESURF Junction Barrier Schottky Rectifier (MR-JBS),” IEEE 2002, 0-7803-7318-9/02, pp. 97-100, no month cited.
Takashi Shimizu, et al., “100V Trench MOS Barrier Schottky Rectifier Using Thick Oxide Layer (TO-TMBS),” Proceedings of 2001 International Symposium on Power Semiconductor Devices & ICs, vol. 9.18, pp. 243-246, Osaka. 2001, no month cited.
Clarence Severt, et al., “Design of Dual Use, High efficiency, 4H-SIC Schottky and MPS Diodes,” Cree, Inc. 2000 published by the American Institute of Aeronautics and Astronautics, Inc., AIAA-2000-2829, pp. 180-184, no month cited.
V. Khemka, et al., “A fully Planarized 4H-SIC Trench MOS Barrier Schottky (TMBS) Rectifier,” IEEE Electron Device Letters, May 2000, 0741-31606/00, vol. 21, No. 5, pp. 286-288.
Benjamin Nunes, et al., “No-Cost Reduced-Leakage Schottky Diode by Ion Implantation,” IEEE/SEMI Advanced Semiconductor Manufacturing Conference 1999, 0-7803-5217-3/99, pp. 172-177, no month cited.
Jeffrey Smith, et al., “A 0.7 μm Linear BICMOS/DMOS Technology for Mixed-Signal/Power Applications,” IEEE 1997, 0-7803-3916-9/97, pp. 155-157, no month cited.

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