Saw device method

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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29 2535, 156656, 156665, 156667, 21912169, 21912185, 427 531, B44C 122, C23F 102, B23K 2600

Patent

active

050910515

ABSTRACT:
Techniques for adjusting the surface acousic wave velocity of a packaged SAW device are described. A first technique involves depositing a film from a cover of the device onto a surface wave propagating surface thereby providing a localized region on said surface where the acoustic properties and, hence, the velocity characteristics of the surface wave propagating surface are altered. An alternate embodiment of a pair of beams are directed through a transparent cover and converge on the surface wave propagating surface, selectively removing a portion of said surface to provide a localized alteration in the acoustic properties of the surface wave propagating surface.

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