Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-01-25
1992-02-25
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29 2535, 156656, 156665, 156667, 21912169, 21912185, 427 531, B44C 122, C23F 102, B23K 2600
Patent
active
050910515
ABSTRACT:
Techniques for adjusting the surface acousic wave velocity of a packaged SAW device are described. A first technique involves depositing a film from a cover of the device onto a surface wave propagating surface thereby providing a localized region on said surface where the acoustic properties and, hence, the velocity characteristics of the surface wave propagating surface are altered. An alternate embodiment of a pair of beams are directed through a transparent cover and converge on the surface wave propagating surface, selectively removing a portion of said surface to provide a localized alteration in the acoustic properties of the surface wave propagating surface.
REFERENCES:
patent: 3006711 (1961-10-01), Silver
patent: 3969640 (1976-07-01), Staudte
patent: 4021898 (1977-05-01), Willis et al.
patent: 4055820 (1977-10-01), Solie
patent: 4097825 (1978-06-01), Gerard
patent: 4190759 (1980-02-01), Hongo et al.
patent: 4204178 (1980-05-01), Mitchell
patent: 4213104 (1980-07-01), Cullen et al.
patent: 4217564 (1980-08-01), Autran
patent: 4243960 (1981-01-01), White et al.
patent: 4249146 (1981-02-01), Yen et al.
patent: 4270105 (1981-05-01), Parker et al.
patent: 4296347 (1981-10-01), Weirauch
patent: 4330768 (1982-05-01), Huang et al.
patent: 4345176 (1982-08-01), Grudkowski et al.
patent: 4364016 (1982-12-01), Tanski
patent: 4409570 (1983-10-01), Tanski
patent: 4435441 (1984-03-01), Mariani et al.
patent: 4442574 (1984-04-01), Wanuga, et al.
patent: 4468582 (1984-08-01), Fujiwara et al.
patent: 4472652 (1984-09-01), Brice et al.
patent: 4504758 (1985-03-01), Wisbey
patent: 4539502 (1985-09-01), Este et al.
patent: 4598224 (1986-07-01), Ballato
patent: 4672254 (1987-06-01), Dolat et al.
patent: 4705698 (1987-11-01), Dine
patent: 4792779 (1988-12-01), Pond et al.
Bohandy, J., et al., Metal Deposition From a Supported Metal Film Using an Excimer Laser, J. Appl. Phys. 60 (4), 15 Aug. 1986, pp. 1538-1539.
Ehrlich, D. J., et al., Submicrometer Patterning by Projected Excimer-Laser-Beam Induced Chemistry, J. Vac. Sci. Technol. B 3(1), Jan./Feb. 1985, pp. 1-8.
Maloney Denis G.
Powell William A.
Raytheon Company
Sharkansky Richard M.
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