4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Tom Hu

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Saw and etch singulation method for a chip package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Semiconductor package with singulation crease

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2632492

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