Sample treating method and apparatus

Details Sample treating method and apparatus Sample treating method and apparatus

1990-03-07

1991-01-15

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 1, 156646, 156651, 156656, 1566591, 156665, 156345, 20419235, 20429831, 427 38, 252 791, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

049851136

ABSTRACT:
A sample treating method and apparatus adapted to treat a sample such as a semiconductor element substrate or the like and, particularly, a sample that must be etched and anticorrosion-treated. The adhered matters formed by the etching of the sample are removed from the sample sufficiently and easily when the etched sample is treated by utilizing the plasma of an anticorrosion gas that is capable of removing the adhered matters. There is required no wet-type anticorrosion treatment enabling the throughput to be improved in treating the samples that must be etched and anticorrosion-treated.

REFERENCES:
patent: 4372807 (1983-02-01), Vossen et al.
patent: 4547260 (1985-10-01), Takada et al.
patent: 4563240 (1986-01-01), Shibata et al.
patent: 4795529 (1989-01-01), Kawasaki

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