Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2007-02-27
2007-02-27
McDonald, Rodney G. (Department: 1753)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S192120, C204S298190, C204S298200, C335S296000, C335S302000, C335S306000
Reexamination Certificate
active
10982616
ABSTRACT:
The magnet arrangement and resulting rotating sputtering magnetron design of an embodiment provides magnetic flux density and distribution to penetrate thick production ferrous targets. Further, the magnetic field shape improves target life by more uniformly removing target material.
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PCT Search report and PCT Written Opinion dated Mar. 8, 2006 (All art cited therein has already been cited by U.S. examiner in the 1st OA.).
Li Chun
Padua Christopher
Stelter Richard
Welk Aron
Blakely & Sokoloff, Taylor & Zafman
Dexter Magnetic Technologies, Inc.
McDonald Rodney G.
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