Rotating sputtering magnetron

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C204S192120, C204S298190, C204S298200, C335S296000, C335S302000, C335S306000

Reexamination Certificate

active

10982616

ABSTRACT:
The magnet arrangement and resulting rotating sputtering magnetron design of an embodiment provides magnetic flux density and distribution to penetrate thick production ferrous targets. Further, the magnetic field shape improves target life by more uniformly removing target material.

REFERENCES:
patent: 4927513 (1990-05-01), Schultheiss et al.
patent: 5399252 (1995-03-01), Scherer et al.
patent: 5746897 (1998-05-01), Heimanson et al.
patent: 5762766 (1998-06-01), Kurita et al.
patent: 5865970 (1999-02-01), Stelter
patent: 6228235 (2001-05-01), Tepman et al.
patent: 6258217 (2001-07-01), Richards et al.
patent: 6491801 (2002-12-01), Gung
patent: 60-116774 (1985-06-01), None
patent: 62-89864 (1987-04-01), None
patent: 03-183123 (1991-08-01), None
PCT Search report and PCT Written Opinion dated Mar. 8, 2006 (All art cited therein has already been cited by U.S. examiner in the 1st OA.).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Rotating sputtering magnetron does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Rotating sputtering magnetron, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Rotating sputtering magnetron will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3869432

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.