Coating apparatus – Gas or vapor deposition – With treating means
Reexamination Certificate
2006-03-28
2006-03-28
Hassanzadeh, Parviz (Department: 1763)
Coating apparatus
Gas or vapor deposition
With treating means
C118S728000, C118S729000, C118S730000
Reexamination Certificate
active
07018479
ABSTRACT:
A reactor for processing semiconductor wafers and the like is provided. The reactor employs one or more rotating components to more evenly distribute temperature or gases within the chamber. In one embodiment, the reactor is provided with rotating reflectors, which reflect the heat generated from radiant heat lamps onto a stationary wafer in a reaction chamber. The rotation of the reflectors provides for a more uniform temperature distribution on the wafer. In another embodiment, the reaction chamber itself is rotated while the wafer is kept stationary. In another embodiment, a rotating showerhead is provided above the wafer through which gases flow to deposit onto the wafer in a uniform manner.
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ASM America Inc.
Hassanzadeh Parviz
Knobbe Martens Olson & Bear LLP
Moore Karla
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