Rotatable sputter target

Details Rotatable sputter target Rotatable sputter target

2007-05-31

2011-10-25

Young, Christopher (Department: 1721)

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C204S192150, C204S192230, C204S298130, C204S298160, C204S298220, C204S298280

Reexamination Certificate

active

08043488

ABSTRACT:
The invention relates to a rotatable sputter target and to a method to manufacture such a sputter target. The sputter target comprises a target material and a magnet array located at the interior of the target material. The magnet array defines a central zone extending along the major part of the length of the target material and defines an end zone at each end of the central zone. The target material comprises a first material and a second material. The target material comprises the first material at least on the central zone and comprises the second material at least on the end zones. The second material has a lower sputter deposition rate than the first material. The second material is preferably applied by thermal spraying. The first material comprises a first element and the second material comprises a compound of the first element of the first material.

REFERENCES:
patent: 5427665 (1995-06-01), Hartig et al.
patent: 5470452 (1995-11-01), Dickey et al.
patent: 5725746 (1998-03-01), Dickey et al.
patent: 0 586 809 (1994-03-01), None

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