Rotary plater with radially distributed plating solution

Details Rotary plater with radially distributed plating solution Rotary plater with radially distributed plating solution

1997-06-23

1999-12-14

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating moving substrate

205 98, 205 80, 204212, 204237, 204224R, 204273, 204DIG7, C25D 500, C25D 2106, C25D 1700, C25B 1500

Patent

active

060012358

ABSTRACT:
A rotary plater and method of plating are provided which improve the uniformity of plating across a plating surface of a workpiece. A plating solution distribution device is located in a plating cup between an anode and a cathode in a spaced relationship therebetween and is centered about a vertical axis of the plating cup. A motor is provided for relatively rotating the cathode and the plating solution distribution device with respect to one another. The plating solution distribution device distributes the plating solution over the plating surface at a distribution rate which increases radially outwardly from the vertical axis. With this arrangement the volume of plating solution at the outer periphery of the plating surface is enriched with ions to promote plating uniformity.

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