Room temperature gold wire wedge bonding process

Details Room temperature gold wire wedge bonding process Room temperature gold wire wedge bonding process

1999-05-27

2000-10-24

Ryan, Patrick

Metal fusion bonding

Process

Using high frequency vibratory energy

2281805, B23K 106, B23K 520, B23K 2010, B23K 3102

Patent

active

061353418

ABSTRACT:
A method of forming a bond structure wherein there are provided a conductive aluminum bond site (15), a gold wire (13) and a wedge bond tool (11). The gold wire is made to contact the aluminum bond site to provide an interface of the gold wire and the aluminum bond site. A mashing force (9) is applied at the interface with the wedge bond tool and ultrasonic energy (5,7) at an ultrasonic frequency above 165 KHz and preferably 193 KHz is applied at the interface for a period sufficient to cause bonding of the gold wire and the aluminum bond site with the application of ultrasonic energy commencing with the interface at room temperature, generally from about 15.degree. C. to about 25.degree. C. The ultrasonic frequency is generally applied for a period from about 0.5 to about 10 milliseconds.

REFERENCES:
patent: 5186378 (1993-02-01), Alfaro
patent: 5201454 (1993-04-01), Alfaro et al.
patent: 5244140 (1993-09-01), Ramsey et al.

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