Robust leaded molded packages and methods for forming the same

Details Robust leaded molded packages and methods for forming the same Robust leaded molded packages and methods for forming the same

2006-10-17

2006-10-17

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S672000

Reexamination Certificate

active

07122884

ABSTRACT:
A method for making a flip chip in a leaded molded package is disclosed. In some embodiments, the method includes using a leadframe structure including a die attach region and leads. The die attach region includes depressions proximate the inner portions of the leads, and an aperture in the die attach region. A semiconductor die is mounted to the die attach region. A molding material passes through the aperture and covers the first surface of the semiconductor die and the die attach region.

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