Robust leaded molded packages and methods for forming the same

Details Robust leaded molded packages and methods for forming the same Robust leaded molded packages and methods for forming the same

2011-03-15

2011-03-15

Lee, Calvin (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C438S123000

Reexamination Certificate

active

07906837

ABSTRACT:
A method for making a flip chip in a leaded molded package is disclosed. In some embodiments, the method includes using a leadframe structure including a die attach region and leads. The die attach region includes depressions proximate the inner portions of the leads, and an aperture in the die attach region. A semiconductor die is mounted to the die attach region. A molding material passes through the aperture and covers the first surface of the semiconductor die and the die attach region.

REFERENCES:
patent: 5540378 (1996-07-01), Mahulikar et al.
patent: 5637916 (1997-06-01), Joshi
patent: 5765280 (1998-06-01), Joshi
patent: 5789809 (1998-08-01), Joshi
patent: 6023080 (2000-02-01), Kojima
patent: 6133634 (2000-10-01), Joshi
patent: 6274905 (2001-08-01), Mo
patent: 6294403 (2001-09-01), Joshi
patent: 6307755 (2001-10-01), Williams et al.
patent: 6320251 (2001-11-01), Glenn
patent: 6337510 (2002-01-01), Chun-Jen et al.
patent: 6391687 (2002-05-01), Cabahug et al.
patent: 6424031 (2002-07-01), Glenn
patent: 6469384 (2002-10-01), Joshi
patent: 6489678 (2002-12-01), Joshi
patent: 6566749 (2003-05-01), Joshi et al.
patent: 6627991 (2003-09-01), Joshi
patent: 6645791 (2003-11-01), Noquil et al.
patent: 6646329 (2003-11-01), Estacio et al.
patent: 6661087 (2003-12-01), Wu
patent: 6683375 (2004-01-01), Joshi et al.
patent: 6777786 (2004-08-01), Estacio
patent: 6861286 (2005-03-01), Estacio et al.
patent: 6867481 (2005-03-01), Joshi et al.
patent: 6870254 (2005-03-01), Estacio et al.
patent: 6943434 (2005-09-01), Tangpuz et al.
patent: 6949410 (2005-09-01), Joshi et al.
patent: 7122884 (2006-10-01), Cabahug et al.
patent: 2002/0065661 (2002-05-01), Everhart et al.
patent: 2002/0066950 (2002-06-01), Joshi
patent: 2002/0066959 (2002-06-01), Joshi
patent: 2002/0100962 (2002-08-01), Joshi
patent: 2002/0125550 (2002-09-01), Estacio
patent: 2002/0155642 (2002-10-01), Noquil et al.
patent: 2002/0171126 (2002-11-01), Estacio et al.
patent: 2002/0192935 (2002-12-01), Joshi et al.
patent: 2003/0011005 (2003-01-01), Joshi
patent: 2003/0042403 (2003-03-01), Joshi
patent: 2003/0052408 (2003-03-01), Quinones et al.
patent: 2003/0067057 (2003-04-01), Wu
patent: 2003/0075786 (2003-04-01), Joshi et al.
patent: 2003/0107126 (2003-06-01), Joshi
patent: 2003/0122247 (2003-07-01), Joshi
patent: 2003/0139020 (2003-07-01), Estacio
patent: 2003/0173684 (2003-09-01), Joshi et al.
patent: 2003/0189248 (2003-10-01), Estacio et al.
patent: 2003/0193080 (2003-10-01), Cabahug et al.
patent: 2003/0205798 (2003-11-01), Noquil et al.
patent: 2004/0207052 (2004-10-01), Joshi et al.
patent: 2005/0130350 (2005-06-01), Estacio et al.
patent: 2005/0167848 (2005-08-01), Joshi et al.
patent: 10062542 (2001-06-01), None
U.S. Appl. No. 09/464,885, Joshi, et al.
U.S. Appl. No. 10/411,688, Joshi, et al.

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