Handling: hand and hoist-line implements – Utilizing fluid pressure – Venturi effect
Patent
1996-11-04
2000-02-15
Kramer, Dean
Handling: hand and hoist-line implements
Utilizing fluid pressure
Venturi effect
294 11, 294907, 414941, 901 46, B25J 1506, B65G 4907
Patent
active
060243937
ABSTRACT:
The amount of particulate contamination produced due to rubbing between a semiconductor substrate and the robotic substrate handling blade has been greatly reduced by the use of specialized materials either as the principal material of construction for the semiconductor substrate handling blade, or as a coating upon the surface of the wafer handling blade. In particular, the specialized material must exhibit the desired stiffness at temperatures in excess of about 450.degree. C.; the specialized material must also have an abrasion resistant surface which does not produce particulates when rubbed against the semiconductor substrate. The abrasion resistant surface needs to be very smooth, having a surface finish of less than 1.0 micro inch, and preferably less than 0.2 micro inch. In addition, the surface must be essentially void-free. In the most preferred embodiments, the upper, top surface of the substrate handling blade is constructed from a dielectric material being smooth, non-porous, and wear-resistant. A preferred material for construction of the substrate handling blade is single crystal sapphire. Other single crystal materials, such as single crystal silicon and single crystal silicon carbide should also perform well. In a particularly preferred embodiment of the substrate handling blade, a capacitance sensor is used to indicate the presence of a semiconductor substrate on the surface of the handling blade and a structure through which vacuum is applied may be used to hold (chuck) the semiconductor substrate to the surface of the handling blade.
REFERENCES:
patent: 4002254 (1977-01-01), Olofsen
patent: 4518349 (1985-05-01), Tressler et al.
patent: 4545327 (1985-10-01), Campbell et al.
patent: 4620738 (1986-11-01), Schwartz et al.
patent: 4705951 (1987-11-01), Layman et al.
patent: 4720130 (1988-01-01), Andou
patent: 4819167 (1989-04-01), Cheng et al.
patent: 4836733 (1989-06-01), Hertel et al.
patent: 4911597 (1990-03-01), Maydan et al.
patent: 4951601 (1990-08-01), Maydan et al.
patent: 5224809 (1993-07-01), Maydan et al.
patent: 5227001 (1993-07-01), Tamaki et al.
patent: 5280979 (1994-01-01), Poli et al.
patent: 5280983 (1994-01-01), Maydan et al.
patent: 5324155 (1994-06-01), Goodwin et al.
patent: 5387067 (1995-02-01), Grunes
patent: 5445486 (1995-08-01), Kitayama et al.
patent: 5483138 (1996-01-01), Shmooklet et al.
patent: 5534073 (1996-07-01), Kinoshita et al.
patent: 5556147 (1996-09-01), Somekh et al.
patent: 5669644 (1997-09-01), Kaihotsu et al.
Chang Yu
Clark Daniel O.
Pham Xuyen
Shamlou Behzad
Tu Wen Chiang
Applied Materials Inc.
Church Shirley
Kramer Dean
LandOfFree
Robot blade for handling of semiconductor substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Robot blade for handling of semiconductor substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Robot blade for handling of semiconductor substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1899782