Rigid-flexible PCB having coverlay made of liquid...

Details Rigid-flexible PCB having coverlay made of liquid... Rigid-flexible PCB having coverlay made of liquid...

2006-05-25

2008-11-18

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S748000

Reexamination Certificate

active

07453045

ABSTRACT:
Disclosed are a rigid-flexible PCB and a method for fabricating the rigid-flexible PCB. Characterized by using a liquid crystalline polymer for the formation of coverlay over flexible regions, the all-layer processing method has the advantage of preventing interlayer delamination, thereby providing a highly reliable rigid-flexible PCB which thus meets the recent requirements of electric appliances for low energy consumption, high frequency adoption, and slimness.

REFERENCES:
patent: 6440542 (2002-08-01), Kariya
patent: 7348492 (2008-03-01), Kawai et al.
patent: 2003/0177635 (2003-09-01), Arrington et al.
patent: 2004/0118596 (2004-06-01), Fuller et al.
patent: 2-92976 (1990-07-01), None
patent: 04-026190 (1992-01-01), None
patent: 2000-183506 (2000-06-01), None
patent: 2002-280733 (2002-09-01), None
patent: 2003-264369 (2003-09-01), None

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