Rigid-flexible PCB having coverlay made of liquid...

Details Rigid-flexible PCB having coverlay made of liquid... Rigid-flexible PCB having coverlay made of liquid...

2006-08-01

2006-08-01

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S846000, C029S847000

Reexamination Certificate

active

07082679

ABSTRACT:
Disclosed are a rigid-flexible PCB and a method for fabricating the rigid-flexible PCB. Characterized by using a liquid crystalline polymer for the formation of coverlay over flexible regions, the all-layer processing method has the advantage of preventing interlayer delamination, thereby providing a highly reliable rigid-flexible PCB which thus meets the recent requirements of electric appliances for low energy consumption, high frequency adoption, and slimness.

REFERENCES:
patent: 5371327 (1994-12-01), Fujinami et al.
patent: 5672400 (1997-09-01), Hansen et al.
patent: 5677045 (1997-10-01), Nagai et al.
patent: 6114005 (2000-09-01), Nagai et al.
patent: 6602583 (2003-08-01), St. Lawrence et al.
patent: 6797345 (2004-09-01), Okamoto et al.
patent: 6884833 (2005-04-01), Chheang et al.
patent: 010074011 (2001-04-01), None

Affiliated with

Also associated with

Rating

Rigid-flexible PCB having coverlay made of liquid... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Rigid-flexible PCB having coverlay made of liquid..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Rigid-flexible PCB having coverlay made of liquid... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3665923