Metal fusion bonding – Process – Using high frequency vibratory energy
Reexamination Certificate
2011-03-22
2011-03-22
King, Roy (Department: 1733)
Metal fusion bonding
Process
Using high frequency vibratory energy
C228S180500, C228S004500
Reexamination Certificate
active
07909228
ABSTRACT:
An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
REFERENCES:
patent: 3670394 (1972-06-01), Daniels et al.
patent: 4460634 (1984-07-01), Hasegawa
patent: 4687693 (1987-08-01), Sheyon et al.
patent: 4776509 (1988-10-01), Pitts et al.
patent: 5314105 (1994-05-01), Farassat
patent: 5403785 (1995-04-01), Arai et al.
patent: 5550326 (1996-08-01), Kesel
patent: 5816472 (1998-10-01), Linn et al.
patent: 5868301 (1999-02-01), Distefano et al.
patent: 6523732 (2003-02-01), Popoola et al.
patent: 6562166 (2003-05-01), Molander et al.
patent: 6582053 (2003-06-01), Terui
patent: 6824630 (2004-11-01), Oishi et al.
patent: 6903450 (2005-06-01), Funato et al.
patent: 7230322 (2007-06-01), Funato et al.
patent: 2004/0217488 (2004-04-01), Luechinger
patent: 2004/0135237 (2004-07-01), Funato et al.
patent: 2005/0279811 (2005-12-01), Bell
patent: 2006/0065697 (2006-03-01), Kobae et al.
patent: 2006/0163315 (2006-07-01), Delsman et al.
patent: 2006/0180635 (2006-08-01), Lim et al.
patent: 0506112 (1992-09-01), None
patent: 05021541 (1993-01-01), None
patent: 05235117 (1993-09-01), None
patent: 11-288960 (1999-10-01), None
patent: 2001-274206 (2001-10-01), None
patent: 2002-313851 (2002-10-01), None
patent: 2002-314018 (2002-10-01), None
patent: 2004-221294 (2004-08-01), None
patent: 05-235104 (2005-09-01), None
patent: 07-058155 (2007-03-01), None
Bryan Ong et al.; “Heavy Al Ribbon Interconnect: An Alternative Solution for Hydrid Power Packaging”; R&D2/Relaibility Engineering; (no date).
Delsman Mark Arnold
Luechinger Christoph Benno
Aboagye Michael
Haynes and Boone, LLP.
King Roy
Orthodyne Electronics Corporation
LandOfFree
Ribbon bonding tool and process does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ribbon bonding tool and process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ribbon bonding tool and process will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2692361