Ribbon bonding tool and process

Details Ribbon bonding tool and process Ribbon bonding tool and process

2011-05-03

2011-05-03

Loney, Donald (Department: 1783)

Metal fusion bonding

Process

Using high frequency vibratory energy

C228S004500, C228S180500, C156S073100

Reexamination Certificate

active

07934633

ABSTRACT:
An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.

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Bryan Ong et al.; “Heavy AI Ribbon Interconnect: An Alternative Solution for Hydrid Power Packaging”; R&D2/Relaibility Engineering; (no date).

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