Ribbon bonding in an electronic package

Details Ribbon bonding in an electronic package Ribbon bonding in an electronic package

2007-02-15

2010-06-29

Trinh, Hoa B (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S612000, C257SE21499

Reexamination Certificate

active

07745253

ABSTRACT:
A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.

REFERENCES:
patent: 6040626 (2000-03-01), Cheah et al.
patent: 2008/0169537 (2008-07-01), Kajiwara et al.

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