RFIC die-package configuration

Details RFIC die-package configuration RFIC die-package configuration

2006-02-14

2006-02-14

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

C257S664000, C257S778000, C029S600000, C029S601000

Reexamination Certificate

active

06998709

ABSTRACT:
A RFIC includes a die and a package. The die contains a radio frequency (RF) input/output (I/O) section, an RF-to-baseband conversion section, and a baseband processing section. The package includes a plurality of connections for connecting to the die. The die is positioned within the package to minimize adverse affects of parasitics components of coupling the RFIO section to an antenna. The positioning of the die within the package may be offset from the center of the package and/or positioned at the edge of the package.

REFERENCES:
patent: 5371404 (1994-12-01), Juskey et al.
patent: 6580163 (2003-06-01), Poulin
patent: 6787901 (2004-09-01), Reyes et al.
patent: 6807063 (2004-10-01), Shimura et al.
patent: 2004/0164382 (2004-08-01), Gerber et al.
patent: 1 126 522 (2001-08-01), None
patent: 99/67754 (1999-12-01), None

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