Electric heating – Metal heating – By arc
Patent
1996-02-02
1998-07-07
Paschall, Mark H.
Electric heating
Metal heating
By arc
21912152, 2191214, 156345, B23K 1000
Patent
active
057772894
ABSTRACT:
An inductively coupled RF plasma reactor for processing semiconductor wafer includes a reactor chamber having a side wall and a ceiling, a wafer pedestal for supporting the wafer in the chamber, an RF power source, apparatus for introducing a processing gas into the reactor chamber, and a coil inductor adjacent the reactor chamber connected to the RF power source, the coil inductor including (a) a side section facing a portion of the side wall and including a bottom winding and a top winding, the top winding being at a height corresponding at least approximately to a top height of the ceiling, and (b) a top section extending radially inwardly from the top winding of the side section so as to overlie at least a substantial portion of the ceiling. The present invention adheres to an optimized coil-dome geometry including a particular dome apex height range relative to the dome base and a particular wafer position range relative to the dome apex.
REFERENCES:
patent: 4990229 (1991-02-01), Campbell et al.
patent: 5346578 (1994-09-01), Benzing et al.
patent: 5401350 (1995-03-01), Patrick et al.
patent: 5449432 (1995-09-01), Hanawa
U.S. Patent Application, Serial No. 08/113,776 entitled"High Density Plasma CVD and Etching Reactor" by Kevin Fairbairn et al. Issue fee paid Oct. 29, 1996, do not have patent number as yet.
Hanawa Hiroji
Loewenhardt Peter K.
Ma Diana Xiaobing
Salzman Philip M.
Yin Gerald Zheyao
Applied Materials Inc.
Paschall Mark H.
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