RF heater arrangement for substrate heating apparatus

Details RF heater arrangement for substrate heating apparatus RF heater arrangement for substrate heating apparatus

2011-07-26

2011-07-26

Chen, Keath T (Department: 1712)

Coating apparatus

Gas or vapor deposition

With treating means

Reexamination Certificate

active

07985295

ABSTRACT:
An RF heating system for a substrate or substrates including a susceptor for supporting the substrate; one or more RF heating coils; and a platen disposed between the RF heating coil and the substrate. The platen is constructed of materials that become heated under RF energy, which will then radiate heat into the susceptor and the substrate. In this way the susceptor need not be constructed of materials that become heated under RF energy thus minimizing levitation. The platen provides a uniform temperature profile across the substrates, benefiting from a more diffused heat source. The RF heating system may also be utilized in CVD apparatus that deposits materials on a continuous tape or roll.

REFERENCES:
patent: 4277320 (1981-07-01), Beguwala et al.
patent: 5401331 (1995-03-01), Ciszek
patent: 6031211 (2000-02-01), Mailho et al.
patent: 2003/0064225 (2003-04-01), Ohashi et al.
patent: 2003/0094451 (2003-05-01), Hamaguchi
patent: 2005/0000453 (2005-01-01), Hwang et al.
patent: 2005/0109461 (2005-05-01), Sun

Affiliated with

Also associated with

Rating

RF heater arrangement for substrate heating apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with RF heater arrangement for substrate heating apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and RF heater arrangement for substrate heating apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2706008