Reworkability solution for wirebound chips using high performanc

Details Reworkability solution for wirebound chips using high performanc Reworkability solution for wirebound chips using high performanc

1997-06-20

2000-01-18

Sough, Hyung-Sub

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361760, H05K 702

Patent

active

060159553

ABSTRACT:
A device and method for enabling the reworkability of an integrated circuit. The device includes a wirebond chip having a bottom surface and a carrier substrate having a first surface and a second surface. The first surface and second surface of the carrier substrate are electrically connected through a series of vias. A bonding agent is used to mechanically attach the wirebond chip to the carrier substrate in addition to wirebonds for electrically connecting the wirebond chip to the substrate. The substrate is attached to a multi-chip module (MCM) by ball grid array (BGA) or controlled collapse chip connection (C4) attaching process.

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