Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-11-06
1993-08-17
Hearn, Brian E.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156644, 437173, H01L 21306, H01L 2126
Patent
active
052365514
ABSTRACT:
A metal/polymeric dielectric substrate has metal conductors selectively disconnected by photoablating the polymeric dielectric with an excimer laser, etching the exposed metal using the polymeric dielectric as a mask, and coating an additional layer of polymeric dielectric. This eliminates the need for depositing and removing a separate photoablatable mask. Siloxane-modified-polyimide is a preferred photoablatable polymeric material and copper is a preferred metal.
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D. B. Tuckerman et al., "Laser Planarization", Solid State Technology, Apr. 1986, pp. 129-134.
IBM Technical Disclosure Bulletin, vol. 27, No. 10A, Mar. 1985, pp. 5764-5765, "Wet Etching for Line Deletion and Short Repair on Ceramic Substrates".
Fleck Linda J.
Hearn Brian E.
Microelectronics and Computer Technology Corporation
Sigmond David M.
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