Rework of polymeric dielectric electrical interconnect by laser

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156644, 437173, H01L 21306, H01L 2126

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active

052365514

ABSTRACT:
A metal/polymeric dielectric substrate has metal conductors selectively disconnected by photoablating the polymeric dielectric with an excimer laser, etching the exposed metal using the polymeric dielectric as a mask, and coating an additional layer of polymeric dielectric. This eliminates the need for depositing and removing a separate photoablatable mask. Siloxane-modified-polyimide is a preferred photoablatable polymeric material and copper is a preferred metal.

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patent: 4965702 (1990-10-01), Lott et al.
D. B. Tuckerman et al., "Laser Planarization", Solid State Technology, Apr. 1986, pp. 129-134.
IBM Technical Disclosure Bulletin, vol. 27, No. 10A, Mar. 1985, pp. 5764-5765, "Wet Etching for Line Deletion and Short Repair on Ceramic Substrates".

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