Rework method for finishing metallurgy on chip carriers

Etching a substrate: processes – Forming or treating electrical conductor article – Repairing circuit

Reexamination Certificate

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C438S004000

Reexamination Certificate

active

06838009

ABSTRACT:
A method and apparatus are provided for reworking of finishing metallurgy on pads of electronic components. The pads are copper or copper
ickel and have a layer of nickel thereon and an overlying layer of gold. The gold layer is removed first followed by the nickel layer and then the component is treated to remove etch and corrosion products. Media blasting is then used to restore the pads to their original condition as on prime parts. The pads are then replated using conventional nickel and gold plating solutions to form the reworked component.

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Wensink, H.; Bernschot, J.W.; Jansen, H.V.; Elwenspoek, M.C.; “High Resolution Powder Blast Micromachining”. , Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual Intenational Conference on, Jan. 23-27, 2000, pp. :769-774.*
Perrin Walker; William H. Tarn, “CRC Handbook of Metal Etchants” p. 334. CRC Press LLC, 1991.

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