Reversible leadless package and methods of making and using...

Details Reversible leadless package and methods of making and using... Reversible leadless package and methods of making and using...

2010-03-08

2011-11-15

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S123000, C438S124000, C438S617000, C257SE21506

Reexamination Certificate

active

08058104

ABSTRACT:
A method for manufacturing a semiconductor device package including an electrically conductive lead frame having a plurality of posts disposed at a perimeter of the package. Each of the posts has a first contact surface at the first package face and a second contact surface at the second package face. The lead frame also includes a plurality of post extensions disposed at the second package face. Each of the post extensions includes a bond site formed on a surface of the post extension opposite the second package face. At least one I/O pad on the semiconductor device is electrically connected to the post extension at the bond site using wirebonding, tape automated bonding, or flip-chip methods. The package can be assembled using a lead frame having pre-formed leads, with or without taping, or using partially etched lead frames. A stack of the semiconductor device packages may be formed.

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patent: 2007/0080437 (2007-04-01), Marimuthu et al.

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