Reversed T-shaped FinFET

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device

Reexamination Certificate

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Details

C257S192000, C257S302000, C257S308000, C257S066000, C257S067000, C257S618000

Reexamination Certificate

active

10761374

ABSTRACT:
A fin field effect transistor (FinFET) includes a reversed T-shaped fin. The FinFET further includes source and drain regions formed adjacent the reversed T-shaped fin. The FinFET further includes a dielectric layer formed adjacent surfaces of the fin and a gate formed adjacent the dielectric layer.

REFERENCES:
patent: 6475890 (2002-11-01), Yu
patent: 6787854 (2004-09-01), Yang et al.
patent: 6894337 (2005-05-01), Wang et al.
patent: 2004/0113171 (2004-06-01), Chiu et al.
Digh Hisamoto et al., “FinFET-A Self-Aligned Double-Gate MOSFET Scalable to 20 nm,” IEEE Transactions on Electron Devices, vol. 47, No. 12, Dec. 2000, pp. 2320-2325.
Yang-Kyu Choi et al., “Sub-20nm CMOS FinFET Technologies,” 2001 IEEE, IEDM, pp. 421-424.
Xuejue Huang et al., “Sub-50 nm P-Channel FinFET,” IEEE Transactions on Electron Devices, vol. 48, No. 5, May 2001, pp. 880-886.
Xuejue Huang et al., “Sub 50-nm FinFET: PMOS,” 1999 IEEE, IEDM, pp. 67-70.
Yang-Kyu Choi et al., “Nanoscale CMOS Spacer FinFET for the Terabit Era,” IEEE Electron Device Letters, vol. 23, No. 1, Jan. 2002, pp. 25-27.

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