Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1989-08-11
1991-07-09
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
174 524, 357 72, H01L 2328, H01L 2302
Patent
active
050307967
ABSTRACT:
A microelectronic device is rendered resistant to reverse engineering by encapsulating it in a dual layer encapsulant. The inner layer is compatible with the operation of the device, and has a greater resistance to chemical attack then does the device. The outer layer includes a filler of barium sulfate and gadolinium oxide, to absorb X-rays and N-rays respectively, is more resistant to chemical attack than the inner layer, and includes a groove around its periphery, to preferentially allow chemical attack radially. A full chemical attack damages the device beyond usable inspection, but a partial chemical attack is insufficient to remove X-ray and N-ray concealment.
REFERENCES:
patent: 3394218 (1968-07-01), Foudriat
patent: 3693252 (1972-09-01), Roberston et al.
patent: 3702464 (1972-11-01), Castrucci
patent: 3749601 (1971-04-01), Tittle
patent: 3778685 (1973-12-01), Kennedy
patent: 3828425 (1974-08-01), Manus
patent: 3889365 (1975-06-01), Brock
patent: 4001655 (1977-01-01), Voyles et al.
patent: 4101352 (1978-07-01), Poulin et al.
patent: 4250347 (1981-02-01), Fierkens
patent: 4264917 (1981-04-01), Ugon
patent: 4434361 (1984-02-01), Meinguss et al.
patent: 4788583 (1988-11-01), Kawahara et al.
Licari James J.
Swanson Dale W.
Hamann H. Fredrick
Ledynh Bot L.
Montanye George A.
Picard Leo P.
Rockwell International Corporation
LandOfFree
Reverse-engineering resistant encapsulant for microelectric devi does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reverse-engineering resistant encapsulant for microelectric devi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reverse-engineering resistant encapsulant for microelectric devi will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-619708