Retainer ring

Abrading – Machine – Rotary tool

Reexamination Certificate

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Details

C451S287000, C451S288000, C451S290000, C451S398000

Reexamination Certificate

active

07666068

ABSTRACT:
A retainer ring and a method of using the retainer ring are provided. The retainer ring has openings along a bottom surface. Grooves encompass the openings and extend to an interior portion of the retainer ring wherein a semiconductor wafer may be held. In operation, a semiconductor wafer is placed inside the retainer ring. As the retainer ring and the semiconductor wafer are moved relative to an underlying polishing pad, slurry is dispensed through the openings in the retainer ring. The grooves in the retainer ring allow the slurry to flow from the openings to the interior portion of the retainer ring and the semiconductor wafer.

REFERENCES:
patent: 6293850 (2001-09-01), Lin et al.
patent: 6336846 (2002-01-01), Park et al.
patent: 6336850 (2002-01-01), Wada et al.
patent: 6454637 (2002-09-01), Gotkis
patent: 6527624 (2003-03-01), Tolles et al.
patent: 7214123 (2007-05-01), Han
patent: 7347767 (2008-03-01), Chandrasekaran
patent: 2007290085 (2007-11-01), None

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