Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1985-06-11
1988-08-16
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29 2535, 296211, 156628, 156634, 156653, 156656, 156657, 1566591, 156662, 156667, 310321, 310367, 73704, 73DIG4, H01L 21306, B44C 122, C03C 1500, C23F 102
Patent
active
047642440
ABSTRACT:
Microminiature resonant sensor structures are prepared according to micromachining/microfabrication techniques, which structures include thin-film deposits of piezoelectric materials. Such piezoelectric deposits may be excited electrically by including metallized conductive paths during fabrication, or optically. The resonant frequency of the sensor structure is varied by subjecting it to a physical variable, or measurand, such as pressure, temperature, flow rate, etc. Similarly, the resonant frequency of the devices may be detected electrically or optically. The microminiature resonant structures include ribbons and wires, hollow beam and cantilevered hollow beams, and single- and double-ended double beam resonant structures such as tuning forks.
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Royer et al., "ZnO on Si Integrated Acoustic Sensor", Sensor and Actuators, 4 (1983), 357-362, May 31-Jun. 3, 1983.
J. Z., "Thin-Film Integrated Sensors Respond Down to 0.1 Hz", Electronic Products, Jun. 29, 1983, pp. 15-17.
Chitty Gordon W.
Morrison, Jr. Richard H.
Olsen Everett O.
Panagou John G.
Zavracky Paul M.
Martin Terrence (Terry)
Powell William A.
The Foxboro Company
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