Resolution doubling lithography technique

Details Resolution doubling lithography technique Resolution doubling lithography technique

1988-07-26

1990-08-07

Howell, Janice A.

X-ray or gamma ray systems or devices

Specific application

Lithography

378145, 2504922, 2505051, 350311, G21K 500

Patent

active

049474138

ABSTRACT:
A lithography system is disclosed which is capable of doubling the spatial frequency resolution associated with conventional systems. A spatial filter, positioned to intercept the Fraunhofer diffraction pattern of the mask being exposed, is configured to prevent certain orders of the diffraction pattern (in most causes the O-order and .+-.2nd, 3rd, . . . orders) from reaching the wafer's surface. The remaining orders reaching the wafer surface (in most cases the .+-. first-order beams) will produce a cos-type interference pattern with a period half of that if the mask grating were imaged without spatial filtering. Therefore, for a system with a given magnification factor m, a mask grating with a period p will be exposed on the wafer surface as a grating with a period of p'=pm/2. Advantageously, the spatial filtering technique of the present invention allows for a variety of different structures (conventional gratings, chirped and phase-shifted gratings, grids, Fresnel zone plates, etc.), as well as structures of different sizes and orientations, to be included on one mask and transferred to the wafer with a single exposure cycle.

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