Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1996-03-26
1999-09-14
Nuzzolillo, Maria
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
G03C 173
Patent
active
059521490
ABSTRACT:
A resist solution for photolithography includes a base resin and an oxygen-free or low-oxygen solvent, wherein an oxygen volume in 1 ml of the solution is 0.05 cm.sup.3 or less under atmospheric pressure.
REFERENCES:
patent: 3645744 (1972-02-01), Fulkerson et al.
patent: 4419437 (1983-12-01), Noonan et al.
patent: 4735877 (1988-04-01), Kato et al.
patent: 4925773 (1990-05-01), Miyamura et al.
patent: 4972026 (1990-11-01), Armstrong et al.
patent: 5120629 (1992-06-01), Bauer et al.
patent: 5164278 (1992-11-01), Brunsvold et al.
patent: 5314789 (1994-05-01), Hawkins et al.
patent: 5375157 (1994-12-01), Maehara
patent: 5380621 (1995-01-01), Dichiara et al.
patent: 5384229 (1995-01-01), Pai et al.
patent: 5422921 (1995-06-01), Chiba
patent: 5455145 (1995-10-01), Tarumoto
patent: 5469489 (1995-11-01), Miyake et al.
patent: 5482817 (1996-01-01), Dichiara et al.
patent: 5485495 (1996-01-01), Miyachi et al.
patent: 5571419 (1996-11-01), Obata et al.
patent: 5599650 (1997-02-01), Bi et al.
patent: 5607816 (1997-03-01), Fitzgerald et al.
Chiba Keiko
Maehara Hiroshi
Sakai Keita
Canon Kabushiki Kaisha
Nuzzolillo Maria
Weiner Laura
LandOfFree
Resist solution for photolithography including a base resin and does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Resist solution for photolithography including a base resin and , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resist solution for photolithography including a base resin and will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1508954