Resist processing method

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Including heating

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430322, 430324, 430327, 430349, G03F 740

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active

061434787

ABSTRACT:
A resist processing method includes (a), to a substrate having a circuit pattern with an uneven surface formed thereon, coating a photoresist solution to, by doing so, form a photoresist film, (b) subjecting the substrate to heat processing to cause a portion of the photoresist film to be chemically modified to create a modified resist layer of a substantially uniform thickness from the uneven surface of the circuit pattern, and (c) selectively removing only a resist portion unmodified at the step (b) to leave a modified resist layer on the uneven surface of the circuit pattern.

REFERENCES:
patent: 4897337 (1990-01-01), Kato
patent: 5919598 (1999-07-01), Flaim
Research Disclosure RD 281017 A, Anonymous, "Planarising photoresist layer on semiconductor wafer--by soft baking, exposing through polka-dot mask, developing and reflow baking", abstract, Sep. 1987.

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