Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2007-12-18
2007-12-18
Walke, Amanda (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
Reexamination Certificate
active
10381671
ABSTRACT:
A resist pattern having a film thickness of 1 to 100 μm and an aspect ratio (ratio of the line width to the film thickness of the resist pattern) of 3.5 or higher is provided in accordance with the present invention, the resist pattern being useful for increasing the density of a semiconductor package substrate circuit, and use of the resist pattern enabling a low conductor resistance to be maintained in fine wiring.This resist pattern can be produced using, for example, a photosensitive resin composition that includes (A) a binder polymer, (B1) a photopolymerizable compound having three ethylenically unsaturated bonds per molecule, (C) a photopolymerization initiator, and (D) either or both of a compound represented by general formula (I):(in the formula, m is an integer of 2 to 6) or a compound represented by general formula (II).
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Hidaka Takahiro
Natori Michiko
Griffin & Szipl, P.C.
Hitachi Chemical Co. Ltd.
Walke Amanda
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