Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2002-11-08
2008-08-26
McPherson, John A. (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S324000, C430S313000, C430S311000, C430S331000
Reexamination Certificate
active
07416837
ABSTRACT:
The present invention provided an improvement to reduce an edge roughness during forming a small and fine pattern. Such and objective is to accomplish that after patterning a resist film, a coating film is formed on the resist film, so as to intermix the resist film material with the coating film material at the interface therebetween to reduce the edge roughness. There is provided a resist pattern-improving material, comprising: (a) a water-soluble or alkali-soluble composition, comprising: (i) a resin, and (ii) a crosslinking agent. Alternatively, The resist pattern-improving material, comprising (a) a water-soluble or alkali-soluble composition, comprising: (i) a resin, and (ii) a nonionic surfactant. According to the present invention, a pattern is prepared in the step, comprising: (a) forming a resist pattern; and (b) coating the resist pattern-improving material on the surface of the resist pattern. According to the present invention, the resist pattern-improving material is mixed with the resist pattern at the interface therebetween. The resist pattern may be formed by irradiating a ArF excimar laser light or a laser light having a wavelength shorter than that of the ArF excimar laser light. The pattern of the resist pattern-improving material includes a base resin which does not substantially transmit the ArF excimar laser light.
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Chemically ampilified ArF excimer laser resists using the absorption band shift method Makoto Nakase, Takuya Naito, Koji Asakawa, Akinori Hongu, Naomi Shida, and Tohru Ushirogouchi Proc. SPIE 2438, 445 (1995) hereinafter referred to as Nakase et al.
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Kozawa Miwa
Nozaki Koji
Chacko Davis Daborah
Fujitsu Limited
McPherson John A.
Westerman, Hattori, Daniels & Adrian , LLP.
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