Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2007-02-06
2008-11-25
Walke, Amanda C. (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S283100, C430S311000
Reexamination Certificate
active
07455950
ABSTRACT:
A resist material includes a polymeric material made of a unit represented by a general formula of the following Chemical Formula; and an acid generator for generating an acid through irradiation with light:wherein R1, R2and R3are the same or different and are a hydrogen atom, a fluorine atom, or a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group with a carbon number not less than 1 and not more than 20; R is a hydrogen atom, a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group with a carbon number not less than 1 and not more than 20; m≧0, n≧0, s>0 (whereas excluding m=n=0) and 1≦k≦3.
REFERENCES:
patent: 5219934 (1993-06-01), Heger et al.
patent: 6980277 (2005-12-01), Sewell
patent: 7033728 (2006-04-01), Dammel
patent: 2005/0058935 (2005-03-01), Kishimura et al.
patent: 2005/0186501 (2005-08-01), Kishimura et al.
Lee, G., et al. “Origin of LER and Its Solution” Proceedings of SPIE, 2005, vol. 5753, pp. 390-399.
Endo Masayuki
Sasago Masaru
McDermott Will & Emery LLP
Panasonic Corporation
Walke Amanda C.
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