Resist ink composition

Details Resist ink composition Resist ink composition

1988-06-06

1991-04-23

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430285, 430287, 522 14, 522 16, 522 26, 522 28, 522 81, 522 83, 522100, 522101, 522103, 525482, 525922, G03F 7031, G03F 7032, C08L 6310, C08G 5902

Patent

active

050099825

ABSTRACT:
A photosetting liquid ink composition developable with a dilute alkaline aqueous solution and comprising (A) a resin curable with an activated energy ray, obtained by the reaction of a saturated or unsaturated polybasic acid anhydride with a product of the reaction of a novolak type epoxy compound and an unsaturated monocarboxylic acid, (B) a photopolymerization initiator, and (C) a diluent can be used for the production of an etching resist or a solder resist in the manufacture of a printed circuit. This composition, when combined with a thermosetting component, produces a photosetting and thermosetting liquid ink composition.

REFERENCES:
patent: 3980483 (1976-09-01), Nishikubo
patent: 4101398 (1978-07-01), Hesse
patent: 4105518 (1978-08-01), McGinniss
patent: 4162274 (1979-07-01), Rosenkranz
patent: 4358477 (1982-11-01), Noomen
patent: 4428807 (1984-01-01), Lee
patent: 4479983 (1984-10-01), Appelt

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