Resist develop process having a post develop dispense step

Details Resist develop process having a post develop dispense step Resist develop process having a post develop dispense step

1996-03-05

1999-04-27

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

G03F 730

Patent

active

058979824

ABSTRACT:
A resist develop process involves the steps of dispensing a developer on a resist on a semiconductor wafer, forming the developer into a puddle where a portion of the resist dissolves into the developer, dispensing additional developer following development, rinsing the wafer with a rinsing agent, and drying the wafer surface. The additional developer dispense step replaces developer with resist dissolved therein with new developer prior to the rinsing step to prevent potential resist precipitation during the rinsing step which can lead to bridging.

REFERENCES:
patent: 3930857 (1976-01-01), Bendz et al.
patent: 4564280 (1986-01-01), Fukuda
patent: 4587203 (1986-05-01), Brault et al.
patent: 4690880 (1987-09-01), Suzuki et al.
patent: 4786578 (1988-11-01), Neisius et al.
patent: 4902608 (1990-02-01), Lamb et al.
patent: 5292605 (1994-03-01), Thomson
patent: 5342738 (1994-08-01), Ikeda
patent: 5451480 (1995-09-01), Novembre

Affiliated with

Also associated with

Rating

Resist develop process having a post develop dispense step does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resist develop process having a post develop dispense step, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resist develop process having a post develop dispense step will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-685444